Note:

 1.Material:

   1.1 Housing:  High temperature  thermoplastic

   1.2 Contact: copper alloy,t=0.20mm

   1.3 Shell: SUS304,t=0.30mm

   1.4 cover: High temperature  thermoplastic

   1.5 out Shell: SUS304 T=0.25

   1.6 Ring: SILICON

   1.7 Epoxy: Epoxy

 2.Specification:

   2.1 Current rating:1,5PIN 2.0A Max/2,3,4PIN 1A Max.

   2.2 Dielectric withstanding

       voltage: 100 V(ac) for 1 min.

   2.3 Contact resistance: 30 mΩ Max.

   2.4 Insulation resistance: 100 MΩ Min.

   2.5 Total mating force: 3.57 Kgf Max.

   2.6 Total unmating force: 1.0 Kgf Min.

   2.7 Temperature range: -30°C~80°C

   2.8 Waterproof: IPX 7Note:

 1.Material:

   1.1 Housing:  High temperature  thermoplastic

   1.2 Contact: copper alloy,t=0.20mm

   1.3 Shell: SUS304,t=0.30mm

   1.4 cover: High temperature  thermoplastic

   1.5 out Shell: SUS304 T=0.25

   1.6 Ring: SILICON

   1.7 Epoxy: Epoxy

 2.Specification:

   2.1 Current rating:1,5PIN 2.0A Max/2,3,4PIN 1A Max.

   2.2 Dielectric withstanding

       voltage: 100 V(ac) for 1 min.

   2.3 Contact resistance: 30 mΩ Max.

   2.4 Insulation resistance: 100 MΩ Min.

   2.5 Total mating force: 3.57 Kgf Max.

   2.6 Total unmating force: 1.0 Kgf Min.

   2.7 Temperature range: -30°C~80°C

   2.8 Waterproof: IPX 7